One of the major advantages of an SoC is that it is usually cheaper, smaller, easy to scale, and even more energy efficient. It is also possible for SoCs to be customized for a specific application, including whatever components, memory, or peripherals necessary, ranging from digital/analog signal ICs, FPGAs, and IOs. An SoC can be based around either a microcontroller (includes CPU, RAM, ROM, and other peripherals) or a microprocessor (includes only a CPU). The SoC integrates all components of a system into one. It may contain digital, analog, mixed-signal, and often radio-frequency functions – all on a single substrate. Think of an SoC as a computer package inside a chip. System-on-a-Chip (SoC)Īn SoC integrates a microcontroller (or microprocessor) with advanced peripherals like graphic processing unit (GPU), Wi-Fi module, or coprocessor. It can also improve signal propagation since the interconnects between components is much shorter. PoP provides more component density and also simplifies PCB design. Packages can be discrete components (memory, CPU, other logic) or a System-in-a-Package stacked with another package for added or expanded functionality. Package-on-a-Package (PoP) Package on a PackageĪ Package-on-a-Package stacks single-component packages vertically, connected via ball grid arrays. SiP is believed to provide more interconnection in the future and possibly face out SoCs. Unlike a SOC that is based on a single silicon die, SiP can be based on multiple dies in a single package. The appeal of a SiP is that it can be compact an otherwise complex system into a very simple package, making it easier to integrate into larger systems. SiP connects the dies with standard off-chip wire bonds or solder bumps.
SiP dies can be stacked vertically or tiled horizontally, unlike slightly less dense multi-chip modules, which place dies horizontally on a carrier.
This means that a complete functional unit can be built in a multi-chip package so that few external components need to be added to make it work. Let’s take a look at them – System-in-a-Package (SiP) Cross section of a SiPĪ system in package (SiP) contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate. An example SiP can comprise several chips-such as a specialized processor, DRAM, flash memory-combined with passive components-resistors and capacitors-all mounted on the same substrate. Here’s a quick look at five common terms used in hardware products or boards and what they denote. If you are new into hardware or still familiarizing yourself to the hardware ecosystem, you will realize some common terms often appear which could sometimes sound confusing or something out of rocket science, but it’s not.
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